Infrared Imager

Lead partner: Sensonor, SINTEF

Technical goals

  • Development of a pixel type infrared imager based on an unique combination of advanced 3D integration processing and nano-dimensioned quantum wells, leading to a device with improved properties compared to existing products on the market.
  • 3D integration using wafer bonding to transfer the thermistor material onto the Read Out Integrated Circuit (ROIC)
  • Wafer level vacuum encapsulation of pixel array
  • Focus on: Material combinations, manufacturability, reliability

Demonstrator & challenges

  • Night vision: automotive, security, surveillance, enhanced vision systems,
  • Thermography
  • Process Control andquality Control
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