For more information please visit the workshop website.
 

ESiP Coordinator: Klaus Pressel
e-BRAINS Coordinator: Reinhard Pufall
 

Chair: Reinhard Pufall Infineon / Peter Ramm Fraunhofer

 

1. "Reliability for heterogeneous 3D integration"

Reinhard Pufall

2. "Low-Temperature 3D Integration Processes for Reliable Heterogeneous Systems" 

Armin Klumpp, Peter Ramm

3. "Robust design for nanostructures for optical field manipulation"

Maaike Taklo

4. "Nanowire  ACF  for low temperature and fine pitch assembly technologies"

Alan Mathewson et al. 

5. "Challenges of Active Medical Implants"   

Renzo dal Molin

 

e-BRAINS/ESiP Agenda  15:30 - 18:00

Chair: Klaus Pressel, Infineon

 

6. "Reliability and failure analysis: Challenge and differentiators for 3D-SiP An introduction into the ESiP project"

Klaus Pressel, Infineon

7. "Heterogeneous Integration of nanowires for gas sensing applications and resulting   reliability issues" 

Anton Köck, AIT, Austria

8. "Thermal and mechanical reliability tests of plastic core solder balls" 
Maaike Visser Taklo, Sintef, Norway

9. "Enhanced failure analysis on unfilled TSV interconnects" 

Frank Altmann/FhG IWMH and  Franz Schrank /AMS Austria) 

10. "Acoustic microscopy for 3D-SiP failure analysis"

Peter Czurratis, PVA Tepla, Germany

11. "Reliability capability evaluation model for highly integrated packages" 

H.J. Albrecht/Siemens, Germany

12. "Implementing anti-counterfeiting technologies into IC packages – impacts & challenges in terms of reliability & failure analysis" 

Stephanie Pesseguier, STMicro France

[1] "Determination of Interface Fracture Parameters by Shear Testing Using Different Theoretical Approaches" R. Dudek 1, B. Brämer 1, J. Auersperg 1, R. Pufall 2, H. Walter 3, B. Seiler 4, B. Wunderle 5; 1 Fraunhofer ENAS, Micro Materials Center Chemnitz, Germany 2  Infineon Technologies, Munich, Germany 3  Fraunhofer IZM, Berlin, Germany 4  CWM GmbH, Chemnitz, Germany 5  TU Chemnitz, Germany

 

[2] "Increasing the Robustness for Reliable Packages by Prediction of Delamination by Cohesive Zone Element Simulation" R. Pufall 1, M. Goroll 1, W. Kanert 1, R. Dudek 2; 1 Infineon Technolgies AG, Neubiberg 2  Fraunhofer ENAS, Chemnitz

 

You can find the presentation here.

The IEEE International 3D System Integration Conference (3DIC) will be held at the "Senri Life-Science center" Osaka on January 31-February 2, 2012.

 

This conference combines the previous ASET and IEEE EDS Society sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the Fraunhofer and IEEE CPMT sponsored International 3D System Integration Workshop held in 2003 & 2007 in Munich. After the first combined conference in San Francisco 2009, the 2nd IEEE 3D System Integration Conference was held in Munich in 2010. The 3rd conference will be held in Osaka in 2011, rotate to San Francisco in 2012 and then rotate back to Munich in 2013.

 

3DIC 2011 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design and test methodology and applications.  The conference invites authors and attendees to submit and interact with 3D researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following:

 

3D Integration Technology.  Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, 3D IC process, monolithic 3D integration, heterogeneous 3D integration (e.g. for MEMS, NEMS), capacitive coupling, inductive coupling, multilevel epitaxial growth, etc.

 

3D IC Circuits Technology.  3D SOC, 3D Memory, 3D Processor, 3D DSP, 3D FPGA, 3D RF and microwave/millimeter wave, 3D analog circuits, 3D biomedical circuits etc.

 

3D Applications.  Imaging, memory, processors, communications, networking, wireless, biomedical, MEMS/NEMS etc.

 

3D Design and Test Methodology.  3D CAD, 3D synthesis, 3D design flows, Signal and power integrity analysis and design in 3D,  3D thermal design and analysis, test and design for test; 3D mechanical stress and reliability design and analysis, etc.

 

Presentation abstracts and proposals for panels and tutorials should be submitted on the conference web site: www.3dic-conf.jp. Deadline for papers and proposals is October 31, 2011.   Abstracts are to be one-page text with one-page of figures and drawings. Accepted papers will be due December 14th, 2011.

 

3DIC2011 Secretariat

C/O Inter Group Corp.

Akasaka-sanno Square Bldg 2-2-12 Akasaka

Minato-ku, Tokyo 107-0052, Japan

 

URL: http://www.intergroup.co.jp

E-mail : info-3dic2011@intergroup.co.jp