ESREF 2014: dedicated CPI - 3D reliability day

ESREF 2014, the “25th EUROPEAN SYMPOSIUM ON RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS“ will be held as a 3-day event between September 30 and October 2, 2014 at the Technische Universität Berlin. 
One day will be dedicated to 3D and CPI (chip package interaction) related reliability and failure issues. The deadline for abstract submission is extended to March 25.

For more information please contact direclty Ingrid De Wolf (chair 3D/CPI session)