Underfill Challenges for 3D Interconnect

A participant of e-BRAINS is contributing to a SEMATECH workshop together with other experts in the field of 3D integration. The title of the workshop is "Underfill Challenges for 3D Interconnect" and it will take place at  Doubletree by Hilton 2050 Gateway Place San Jose, California on 9 November, 2012. The event will be open by Peter Ramm, Fraunhofer EMFT Munich and has the following agenda:

8:00 AM – 8:30 AM Registration and Continental Breakfast
8:30 AM – 8:45 AM Welcome; Peter Ramm, Fraunhofer EMFT Munich
8:45 AM – 9:00 AM The Role of SEMATECH; Brian Sapp, SEMATECH
9:00 AM – 9:40 AM 3DIC Markets and Technology Drivers; Charles  Woychik, Invensas
9:40 AM – 10:20 AM Challenges Related to Underfill for European Activities on 3D Integration; Maaike M. V. Taklo, SINTEF
10:20 AM – 10:35 AM Break
10:35 AM – 11:15 AM Thermal  Challenges  for 3D; Ken Goodson, Stanford University
11:15 AM – 11:55 AM Automated Thermo Mechanical Modeling of 3D Chip Stacking; Kamal Karimanal, Cielution LLC
11:55 AM – 1:00 PM Lunch
1:00 PM – 1:40 PM The Current Capabilities and Future Challenges of Acoustic Microscopy (AM) for 3D Interconnect Underfill Inspection; Steven Marvell, Sonoscan
1:40 PM – 2:20 PM X-Ray Microscopy: The Ultimate Inspection Technology for 3D IC Packaging; Yuri Sylvester, Xradia
2:20 PM – 3:00 PM 2012 Industry Survey Results: Underfill Challenges for High Volume Manufacturing; Sunoo Kim, SEMATECH
3:00 PM – 3:30 PM Discussion and Wrap-Up

For more information please visit the workshop website.