e‐BRAINS Workshop at EPFL Feb. 17, 2014

e‐BRAINS Workshop on:
Heterogeneous 3D integration of sensors and circuits for Smart Microsystems
Date: Feb. 17, 2014 
Place: Room QI.E building E Innovation Park – EPFL, Switzerland 

The e-BRAINS workshop included of a series of excellent technical contributions both by consortium members and by external speakers. More than 30 international workshop attendees followed technical presentations listed below:

Presentations are now available for download: Workshop presentations
8:55 – 9:00 Opening
Adrian M. Ionescu, EPFL.
9:00 – 9:30 Overview of the e-BRAINS project
Reinhard Pufall, Infineon, Germany.
9:30 – 10:00 Heterogeneous Sensor Integration for Smart Ambient Intelligence Systems
Peter Ramm, Fraunhofer EMFT, Germany.
10:00 – 10:30 Miniature MEMS-based timing and radio solutions using 3-D integrations
David Ruffieux, CSEM, Switzerland.
10:30 – 10:45 Coffee break
10:45 – 11:15 Robustness and Integration of Nano Sensor Devices
Maaike Taklo, Sintef, Norway.
11:15 – 11:45 CNT sensor arrays for gas sensing
Helene Lepoche1, Hoel Guerrin2, Roland Pohle3, 1CEA-LITEN, France, 2EPFL, Switzerland, 3Siemens, Germany.
11:45 – 12:15 Vertically Stacked SiNW-Based 3D FET for high response pH sensing – a collaborative framework between e-BRAINS and SiNAPS EC projects
Elizabeth Buitrago, EPFL, Switzerland.
12: 15 – 13:45 Lunch
13:45 – 14:15 Compact and Micro-Engineered Power Modules: Power Harvesting, Conditioning, Protection and Storage, Eric Yeatman, Imperial College, UK.
14:15 – 14:30 Nanowire based solar cells for solar energy harvesting, Esther Alarcon Llado, Anna Fontcuberta I Moral, EPFL, Switzerland.
14:30 –15:00 Advances in CNT via technology, John Robertson, University of Cambridge, UK.
15:00 – 15:30 Coffee Break
15:30 – 16:00 Where Micro meets Nano – characterization issue in heterogeneous integration
P.Grabiec, T.Bieniek, G.Janczyk, P.Janus, T.Gotszalk, ITE, Poland
16:00 – 16:30 MEMS reliability testing for heterogeneous integration
Ingrid de Wolf, IMEC, Belgium
16:30 – 17::00 Heterogeneous Integration Technologies for Smart Systems Design
Alan Mathewson, Tyndall, Ireland.
17:00 – 17:30 MEMS and 3D heterogeneous integration: applications and markets
Frederic Breussin, Yole, France.