The NanoLab (EPFL) team has contributed to the ZeroPower Networking Workshop (16-18 October 2012 – Barcelona, Spain) presenting junctionless SiNW FETs as 3D structures for low power sensors, introduced BioFETs (Si-based nanostructures) for biosensing in integrated 3D heterogeneous systems, discussed its fabrication process, flow validation and corresponding numerical 3D TCAD simulation. The presetnation has also highlighted an interpoject, Synaps and eBRAINS, R&D exchange.
Reference:
E. Buitrago, G. Fagas*, M. Fernandez-Bolaños and A.M. Ionescu (EPFL, *Tyndall)
Junctionless Silicon Nanowire Transistor Design for the Tunable Operation of a Low Power Sensor
ZeroPowerNetworking Workshop; 16-18 October 2012 – Barcelona, Spain
FP7 e-BRAINS Project https://www.e-brains.org/
FP7 SiNAPS Project http://www.sinaps-fet.eu/
The e-BRAINS Consortium has issued the supporting letter for the “Guardian Angels for a Smarter Life” FET Flagship Project. The e-BRAINS considers this FET Flagship Project as a fundamental tool to substantially reinforce the efforts in this strategic domain for Europe. This strong European structuring will allow us to tackle the dramatic innovations needed for a very broad spectrum of societally relevant applications.
Alan Mathewson (Tyndall Institute, Ireland) has delivered the Keynote Talk "Status of Research and Application Development of 3DIC Technology in Europe" at the IEEE International 3D System Integration Conference (
3DIC) Osaka on Feb 1, 2012.
You can find the presentation
here.
Handbook of Wafer Bonding
Editors: Peter Ramm , James Jian-Qiang Lu, Maaike M. V. Taklo
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.
Part I sorts the wafer bonding technologies into four categories ? Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Magna Diagnostics, a developer of the fast, cost-effective and robust point-of-care diagnostics platform is promoting the e-BRAINS Project. Visit
Magna Diagnostics partner
webpage.
Event: International Wafer-Level Packaging Conference - IWLPC, Santa Clara, Nov 4-5, 2011
Peter Ramm, Fraunhofer EMFT actively controbuted to the IWLPC Panel Discussion and discussed:
- 3D-IC integration (TSV-Technology for 3D-integrated ICs) is seen as (too) expensive and because of that delayed to 2015 or later
- So-called 2.5D integration (Si Interposers) with cost issues too (relatively expensive in comparison to performance achieved) - alternative glass interposer concept presented by Rao Tumalla / GiorgiaTech
- 3D memory stacks (TSV in periphery) will come soon (2012)
- Heterogeneous MEMS/IC integration is recognized as one of the key drivers for 3D TSV integration (e-BRAINS !) because TSVs just on densities of global interdconnect level - instead of very high densities for 3D-ICs. Focus on Reliability not on integration density !
Other technical details are availeble in
attached presentation 