e-BRAINS: Recent Publications

The e-BRAINS Consortium members have recently published a series of scientific papers:
  1. Montserrat Fernández-Bolaños1*, Peter Ramm2, Reinhard Pufall3, Elizabeth Buitrago1, Christian Zilch4, Hoël Guerin1, Hélène Le Poche5, Roland Pohle6, Alexandru Popescu6 and Adrian M. Ionescu1, 3D Heterogeneous Integration for Nanosensor Systems – the EU-Project e-BRAINS, invited talk at SSDM 2013 Solid State Device and Materials, Fukuoka (Japan) 24th-27th Sept. 2013
  2. Astrid-Sofie B. Vardøy, H.J. van de Wiel, Stian Martinsen, Greg R. Hayes, Hartmut R. Fischer, Knut E. Aasmundtveit, Adriana Lapadatu, Maaike M. V. Taklo, "Void formation and bond strength investigated for wafer-level Cu-Sn SLID bonding", to be presented at iMAPS 2013
  3. Kafil M. Razeeb Non-enzymatic electrochemical sensor technology based on vertically aligned 3-D nanowire array platform 224th ECS Meeting, San Francisco, California, USA Invited talk Oct 27 – Nov 1 2013
  4. Louise Devlin, Mamun Jamal and Kafil M. Razeeb Novel pH sensor based on anthraquinone–ferrocene modified free standing gold nanowire array electrode Anal. Methods vol. 5, pp. 880-884  2013
  5. M. Wiessflecker, G. Hofer, G. Holweg, and W. Pribyl An 11 bit SAR ADC Combining a Split Capacitor Array with a Resistive Ladder and a Configurable Noise Time Domain Comparator in Proc. IEEE 55th Int Circuits and Systems (MWSCAS) Midwest Symp pp. 101–104  2012
  6. M. Wiessflecker, G. Hofer, G. Holweg, and W. Pribyl An impedance measurement circuit for wirelessly powered ICs in 20th Austrian Workshop on Microelectronics   2012
  7. M. Wiessflecker, G. Hofer, G. Holweg, H. Reinisch, and W. Pribyl A sub 1V self clocked switched capacitor bandgap reference with a current consumption of 180nA in Proc. IEEE Int Circuits and Systems (ISCAS) Symp pp. 2841–2844  2012
  8. M. Wiessflecker, G. Hofer, H. Reinisch, S. Gruber, G. Holweg, W. Pachler, M. Klamminger and W. Pribyl A Remotely Powered Multi Frequency RFID Sensing Tag with Integrated Impedance Measurement Interface Proc. IEEE Int Circuits and Systems (ISCAS) Symp   2013
  9. Maaike M.V. Taklo, "Challenges Related to Underfill for European Activities on 3D Integration" (invited), SEMATECH Underfill challenges for 3D interconnect, San Jose, November 9, 2012
  10. Maaike M.V. Taklo, Astrid-Sofie Vardøy, Ingrid De Wolf, Veerle Simons, H.J. van de Wiel, Adri van der Waal, Adriana Lapadatu, Stian Martinsen, Bernhard Wunderle, "Residual stress in silicon caused by Cu-Sn wafer-level packaging", to be presented at InterPACK 2013
  11. Maaike M.V. Taklo, Joachim Seland Graff, Daniel Nilsen Wright, Helge Kristiansen, Lars Hoff, Knut Waaler, "Failure Analysis Of Thermally And Mechanically Stressed Plastic Core Solder Balls", ECTC 2013, May, 2013
  12. Mamun Jamal, Maksudul Hasan, Alan Mathewson and Kafil M. Razeeb Disposable sensor based on enzyme-free Ni nanowire array electrode to detect glutamateBiosens. Bioelec.  vol. 40, pp. 213-218  2013
  13. Mamun Jamal, Maksudul Hasan, Michael Schmidt, Nikolay Petkov, Alan Mathewson and Kafil M. Razeeb Core@shell Ni@NiO nanowire array electrode for catalytic activity towards glucose, 223rd ECS Meeting, Toronto, Ontario, Canada Abstract no. 1471, oral presentation May 12-17 2013
  14. R. Pufall, M. Goroll, P. Ramm, M. Taklo, "Lessons learned from the European research project e-BRAINS, An overview of activities and results on methodology of reliability and robustness", Microcar 2013
  15. Sanja Hadzialic and Maaike M.V. Taklo, "Robust design for nanostructures for optical field manipulation”, presented at "Heterogeneous 3D integration considered by the perspective of reliability studied in the European projects e-BRAINS and ESiP", ESREF 2012, 1st October, Cagliari, Italy, 2012
  16. Sanja Hadzialic, Ib-Rune Johansen, Maaike M. Visser Taklo, "Nano Structured Optical Coatings, Mirrors and Anti-Reflective Surfaces in Single Crystal Silicon by Patterning of the Silicon Surface", Northern Optics 2012, 19-21 November, Snekkersten, Denmark, 2012
  17. Torleif André Tollefsen, Maaike M. Visser Taklo, Thor Bakke, Nicolas Lietaer, Per Dalsjø Jakob Gakkestad, "Reliability of TSVs and wafer-level bonding for a 3D integrable SOI based MEMS application", IWLPC 2012, 5-8 November, San Jose, USA, 2012