Results

Completed List of Publications (e-BRAINS Project: Sept. 2010 - April 2014)
 
Keynote 
1. R. Pufall, M. Goroll, G. M. Reuther, "Understanding delamination for fast development of reliable packages for automotive applications", EUROSIME 2014.
2. M.M.V. Taklo et al. "European activities in heterogeneous sensor integration (e-BRAINS)" 3DIC, San Francisco, CA, USA, 2-4 October 2013.
3. A. Mathewson and P. Ramm, "Status of Research and Application Development of 3D-IC Technology in Europe," Proc. 3DIC 2012, Osaka, Japan, 2012.
4. P. Ramm, "The European 3D Technology Platform for Heterogeneous Systems
Opening," Int. Wafer-Level Packaging Conference IWLPC 2010, Santa Clara, USA
5. M. Fernández-Bolaños, A. M. Ionescu, Heterogeneous Integration for Novel Functionality, Proc. IEEE 3D System Integration Conference 2010 - 3DIC Munich, Nov. 2010.
6. P. Ramm, A. Klumpp, J. Weber, N. Lietaer, M. Taklo, W. De Raedt, T. Fritzsch, P. Couderc, 3D Integration Technology: Status and Application Development, Proc. ESSCIRC/ESSDERC 2010 Sevilla, Spain, p. 9-16, IEEE Xplore 978-1-4244-6664-1/10 ©2010 IEEE).
 
Invited talks 
7. M. M.V. Taklo et al., "Heterogeneous sensor integration; increased technology readiness level," Date'14, Dresden, Germany, 2014. 
8. M. M. V. Taklo, "Kvalitet på elektronikk - hva går galt?", Elmåledagene 20. nov. 2013, Lillestrøm, Norge 
9. K. M. Razeeb, M. Jamal, M. Hasan and A. Mathewson, "Non-enzymatic electrochemical sensor technology based on vertically aligned 3-D nanowire array platform", 224th ECS Meeting, San Francisco, California, USA, 27 Oct.-1 Nov., 2013.
10. A. Popescu, R. Strzoda, C. Kraeh, H. Hedler, C. Bayer, J. Stolle, Martin Zeitlmair, Jonathan Finley,  "Miniaturized TDLS Optical Gas Sensing Device for Air Quality Monitoring", Omics Publishing Group, 2013, International Conference and Exhibition on Lasers, Optics & Photonics, OMICSgroup, 07-09 October 2013, San Antonio, USA.
11. M. Fernández-Bolaños, P. Ramm, R. Pufall, E. Buitrago, C. Zilch, H. Guerin, H. Le Poche, R. Pohle, A. Popescu and A. M. Ionescu, "3D Heterogeneous Integration for Nanosensor Systems - the EU-Project e-BRAINS", Solid State Device and Materials, SSDM 2013, Fukuoka, Japan, 24-27 Sept., 2013.
12. M.M.V. Taklo, "Challenges Related to Underfill for European Activities on 3D Integration", SEMATECH Underfill challenges for 3D interconnect, San Jose, USA, Nov. 9, 2012.
 
Book articles, chapters and edition
13. Philip Garrou, Mitsumaso Koyanagi and Peter Ramm (eds.): Handbook of 3D Integration, Vol. 3, 3D Process Technology, Wiley-VCH, 2014 (ISBN: 978-3-527-33466-7)
14. Rozalia Beica, Jean-Christophe Eloy and Peter Ramm: Key Applications and Market Trends for 3D Integration and Interposer Technology, Handbook of 3D Integration, Vol. 3, Wiley-VCH, 2014 (ISBN: 978-3-527-33466-7)
15. James J.-Q. Lu, Dingyou Zhang, and Peter Ramm: Overview of Bonding and Assembly Technologies and Assembly for 3D Integration, Handbook of 3D Integration, Vol. 3, Wiley-VCH, 2014 (ISBN: 978-3-527-33466-7)
16. K. M. Razeeb, M. Jamal, M. Hasan and A. Mathewson, "Vertically aligned nanowire based sensors and its applications", Nanobiosensors and Nanobioanalysis, Springer-Verlag, Wien, New York, (in preparation).
17. P. Ramm, J. J.-Q Lu, M. M.V. Taklo : Handbook of Wafer Bonding, Wiley-VCH, 2012 (ISBN: 978-3-527-32646-4).
18. P. Garrou, J. J.-Q. Lu, and P. Ramm, Three-Dimensional Integration, Handbook of Wafer Bonding (Book chapter 18), Wiley VCH, edited by Peter Ramm, James Lu, Maaike Taklo, 2012.
19. P. Ramm, J. J.-Q Lu, M. M.V. Taklo, Introducction to Wafer Bonding, Handbook of Wafer Bonding, Wiley-VCH, 2012 (ISBN: 978-527-32646-4).
20. M. M.V. Taklo, Handbook of Wafer Bonding, Applications of Wafer Bonding, Wiley-VCH, 2012 (ISBN: 978-527-32646-4).
21. A. Klumpp, P. Ramm, Temporary Adhesive Bonding with Reconfigurable of known Good Dies for Three-Dimensional Integrated Systems, Handbook of Wafer Bonding, Wiley-VCH, 2012 (ISBN: 978-527-32646-4).
22. K. M. Razeeb, M. Jamal, J. Xu and M. Hasan, Nanowire Array electrodes in Biosensor Applications (Book chapter 4), Nanowires: Properties, Synthesis and Applications, ISBN 978- 1-61470-129-3, Nova Science Publishers, Inc., In Press, 2011. 
 
Reports in online magazine
23. "Europe in 3D: The Brains behind e-BRAINS", 3D InCites Stirring up interest in 3D IC technology and 3D integration, Jan 2014 (http://www.3dincites.com/2014/01/europe-3d-brains-behind-e-brains/)
24. "New Apps for 3D Chips", Online Magazine Semiconductor Engineering, By Mark LaPedus, Nov 2012 (http://semiengineering.com/new-apps-for-3d-chips/)
 
Journal Papers
1. A. Popescu, R. Strzoda, C. Kraeh, H. Hedler, C., J. Stolle, M. Zeitlmair and J. Finley, "Miniaturized TDLS optical gas sensing device for air quality monitoring", J Phys Chem Biophys, 2013 doi: 10.4172/2161-0398.S1.002.
2. C. Kraeh, A. Popescu, M. Schieber, H. Hedler, T. Bieniek, G. Wielgoszewski, M. Moczala and J. Finley,"Fabrication of high aspect ratio microtube arrays for 2D photonic crystals", Materials Research Express, Vol. 1, No. 2, 026201, 2014.
3. E. Buitrago M. Fernández-Bolaños, S. Rigante, C. F. Zilch, N. Schröter, A. Nightingale, A.M. Ionescu, "The top-down fabrication of a 3D-integrated, fully CMOS-compatible FET biosensor based on vertically stacked SiNWs and FinFETs", Sensors and Actuators B: Chemical, 193 (2014) 400.
4. E. Buitrago, M. Fernández-Bolaños, Y.M. Georgiev, R. Yu, O. Lotty, J.D. Holmes, A.M. Nightingale, A.M. Ionescu, High Performance Vertically Stacked SiNW-Based 3D FET for the Attomolar Detection of Streptavidin and High Response pH Sensing, Biosensors and Bioelectronics, Under Review (2014).
5. E. Buitrago, M. Fernández-Bolaños, Y.M. Georgiev, R. Yu, O. Lotty, J.D. Holmes, A.M. Nightingale, A.M. Ionescu, Electrical Characterization of High Performance, Liquid-Gated Vertically Stacked SiNW-Based 3D FET for Biosensing Applications, Sensors and Actuators B: Chemical, Accepted in press (2014). 
6. E. Buitrago, G. Fagas, M. Fernández-Bolaños Badia, Y. M. Georgiev, M. Berthomé, and A. M. Ionescu, "Junctionless silicon nanowire transistors for the tunable operation of a highly sensitive, low power sensor", Sensors and Actuators B: Chemical, vol. 183, pp. 1-10, 2013.
7. E. Buitrago, M. Fernández-Bolaños, A. M. Ionescu, "Vertically Stacked Si Nanostructures for Biosensing Applications". Microelectron. Eng. 2012, 97, 345-348.
8. G. Fagas, M. Nolan, Y. M. Georgiev, R. Yu, O. Lotty, N. Petkov, J. D. Holmes, G. Jia, B. Eisenhawer, A. G.  F. Falk, N. Khosropour, E. Buitrago, M. Fernández-Bolaños Badia, A. M. Ionescu, M. Kayal, "Design and Component Testing of a Miniaturised Autonomous sensor based on a Nanowire Materials Platform", Microsyst. Technol, (2014) 1-18..
9. G. Janczyk, T. Bieniek, J. W?sowski, P. Grabiec, "Investigation on Reliability of Interconnects in 3D Heterogeneous Systems by Ageing Beam Resonance Method submitted to Microelectronic Journal (Elsevier, MEJ-S-13-00565-2).
10. H. Guerin, H. Le Poche, R. Pohle, E. Buitrago, M. Fernández-Bolaños, J. Dijon, A. M. Ionescu, Carbon nanotube gas sensor array for selective analyte discrimination, submitted to Sensors and actuators B: Chemical, 2014.
11. H. Guerin, H. Le Poche, R. Pohle, L. Syavoch Bernard, E. Buitrago, R. Ramos, J. Dijon, A. M. Ionescu, High-yield, In-situ Fabrication and Integration of Horizontal Carbon Nanotube Arrays at the Wafer Scale for Robust and Reliable Ammonia Sensors, submitted to Carbon, 2014.
12. H. Guerin, D. Tsamados, H. Le Poche, J. Dijon, A. M. Ionescu, "In-situ grown horizontal carbon nanotube membrane", Microelectronic Engineering 97 (2012) 166-168 
13. J. Tao, M. Hasan, X. Ju, A. Mathewson, K. M. M,Razeeb, Investigation of prcess parameters and characterisation of nanowoire anisotropic conductive film for interconnect applications, IEEE Transaction on Components, Packaging, and Manufacturing Technology . Vol. 4 No. 3 March 2014,  pp 538-547.
14. K. Dawson, M. Buadequin, A. O'Riordan, Single On-chip Gold Nanowires for Electrochemical Biosensing of Glucose. The Analyst, In Press, 2011 
15. L. Devlin, M. Jamal and K. M. Razeeb, "Novel pH sensor based on anthraquinone-ferrocene modified free standing gold nanowire array electrode", Anal. Methods vol. 5, pp. 880-884  2013.
16. M. Jamal, M. Hasan, A. Mathewson and K. M. Razeeb, "Disposable sensor based on enzyme-free Ni nanowire array electrode to detect glutamate", Biosens. Bioelec.  vol. 40, pp. 213-218  2013.
17. M. Jamal, M. Hasan, M. Schmidt, N. Petkov, A. Mathewson and K. M. Razeeb, "Shell@core coaxial NiO@Ni nanowire arrays as high performance enzymeless glucose sensor", J. Electrochem. Soc., 160 (11), B207-B212, (2013).
18. M. Jamal, F. M. Shaikh, B. Aslam and K. M. Razeeb, Sensor and biosensor to detect vascular graft infection: diagnosis and challenges, Anal. Methods, 4, 1865, (2012).
19. M. Jamal, M. Hasan, A. Mathewson and K. M. Razeeb, Non-enzymatic and Highly Sensitive H2O2 Sensor Based on Pd Nanoparticle Modified Gold Nanowire Array Electrode, J. Electochem. Soc., 159, Issue 11, B825-B829, 2012. 
20. M. Jamal, M. Hasan, J. Mischieri, A. Mathewson and K. M. Razeeb, Fabrication of Horseradish Peroxidase Modified 3D Pt Nanowire Array Electrode and Its Electro-catalytical Activity towards H2O2, ECS Transaction, in press, 2011. 
21. P. Ramm "The common ground of interposer and 3D integration technology", Future Fab International, Issue 45, April 2013.
 
Conference Papers
1.    A. Heinig, M. Dittrich, S. Reitz, J. Stolle, „A Flow for Parasitics Extraction in 3D-Systems”,  Int. Semiconductor Conference Dresden-Grenoble (ISCDG) 2012, Grenoble, France, pp. 37-40, 24-26 Sept. 2012
2.    A. Klumpp, P. Ramm, G. Franz, C. Rue, L. Kwakman, Reliability Testing and Failure Analysis of 3D Integrated Systems, Proc. Interconnect Technology Conference - IITC 2011, May 2011.
3.    A. Lapadatu, S. Martinsen, G. Kittilsland, A.-S. B. Vardøy, T. Thuy Luu, N Høivik, "Wafer level vacuum encapsulation for uncooled microbolometers", Proc. International Conference on Wafer Bonding WaferBond'13, 115-116, Stockholm, Sweden, 2013.
4.    A. Lapadatu, "Heterogeneous integration for infrared sensors", presented at the European Solid-State Device Research Conference ESSDERC 2013 “In the Quest for Zero Power: Enabling Smart Autonomous System Applications” workshop, Bucharest, Romania, September 2013.
5.    A. Lapadatu, T. I. Simonsen, G. Kittilsland, B. Stark, N. Hoivik, V. Dalsrud, G. Salomonsen, “Cu-Sn wafer level bonding for vacuum encapsulation of microbolometer focal plane arrays“, ECS Transactions, Vol. 33, no. 4, p.73., presented at the 218th ECS Meeting, Semiconductor Wafer Bonding 11: Science, Technology, and Applications, October 2010, Las Vegas, Nevada.
6.    A. Popescu, R. Strzoda, C. Kraeh , H. Hedler, C. Bayer, J. Finley, “Miniaturized and Cost Effective TDLAS Optical Gas Sensing Devices”, Int. Conf. FLAIR 2014- Field Laser Applications in Industry and Research, May 5-9, 2014, Pratolino, Italy.
7.    A. Roer, A. Lapadatu, E. Wolla, G. Kittilsland, “High performance LWIR microbolometer with Si/SiGe Quantum well thermistor and wafer level packaging”, Proc. SPIE, Vol. 8704, Infrared Technology and Applications XXXIX, 8704-41 (2013), presented at SPIE Defense and Security Symposium Baltimore, Maryland, USA, May 2013.
8.    A-S.B. Vardøy, H.J. van de Wiel, Stian Martinsen, G. R. Hayes, H. R. Fischer, K. E. Aasmundtveit, A. Lapadatu, M. M. V. Taklo, “Void formation and bond strength investigated for wafer-level Cu-Sn SLID bonding”, 46th International Symposium on Microelectronics, International microelectronics assembling and packaging society iMAPS 2013 (Best of session award).
9.    B. Debecker, K. Vanstreels, M. Gonzalez, B. Vandevelde, “Delamination in BEOL: analysis of interface failure by combined experimental & modeling approaches”, Reliability Physics Symposium (IRPS), pp. 5C.2.1-5C.2.6, Monterey, USA; 11-18 April, 2013.
10.  C. Kraeh, A. Popescu, M. Schieber, H. Hedler, M. Zeitlmair and J. Finley, “Micro-Rod arrays as 2D Photonic Crystal Structures for Light Trapping and Guiding”, 3rd EOS Conference on Manufacturing of Optical Components (EOSMOC 2013).
11.  C. Kraeh, M. Schieber, A. Popescu, H. Hedler and J. Finley “Photonic Crystal Materials Realized by High Aspect Ratio Micro-Rod Arrays”, IEEE Photonics Conference 2012, 23-27 September, Burlingame, USA.
12.  E. Buitrago, M. Fernández-Bolaños, Y.M. Georgiev, R. Yu, O. Lotty, J.D. Holmes, A.M. Nightingale, A.M. Ionescu, Attomolar Streptavidin and pH Low Power Sensor Based on 3D Vertically Stacked SiNW FETs, International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan (2014).
13.  E. Buitrago, M. Fernández-Bolaños Badia, Y. M. Georgiev, R. Yu, O. Lotty, J. D. Holmes, A. M. Nightingale, and A. M. Ionescu, “Functionalized 3D 7x20-array of Vertically Stacked SiNW FET for Streptavidin Sensing”, 71th Annual Device Research Conference (DRC), 2013, Notre Dame, IN, 2013.
14.  E. Buitrago, G. Fagas, M. Fernández-Bolaños, Y.M. Georgiev, M. Berthomé, A.M. Ionescu, Junctionless Silicon Nanowire Transistors for the Tunable Operation of a Highly Sensitive, Low Power Sensor, International Conference on Bio-sensing Technology, Sitges, Spain (2013).
15.  E. Buitrago, M. Fernandez-Bolaños, A. M. Ionescu, Vertically Stacked Silicon Nanowires/ Fin-Type Structures for Bio-sensing Applications, 37rd International Conference on Micro- and Nano-Engineering, MNE (2011), Berlin (Germany).
16.  G. Janczyk, T. Bieniek, J. Wąsowski, P. Grabiec, “Investigation on Reliability of Interconnects in 3D Heterogeneous Systems by Ageing Beam Resonance Method”, NanoTech 2013 Washington, USA, 12-16.05.2013
17.  G. Wielgoszewski, M. Moczała, D. Kopiec, T. Gotszalk, T. Bieniek, G. Janczyk, P. Janus, P. Grabiec, C. Kraeh, A. Popescu, «Estimation of the elastic modulus of polycrystalline-silicon microrods using AFM-based techniques”  39th International Conference on Micro and Nano Engineering (MNE), London, UK, 16-19 Sept., 2013.
18.  H. Guerin, H. Le Poche, R. Pohle, M. Fernández-Bolaños, J. Dijon, A. M. Ionescu, “Carbon Nanotube Resistors as Gas Sensors: Towards Selective Analyte Detection With Various Metal-Nanotube Interfaces”, 43rd ESSDERC, Bucharest, Roumania, 2013.
19.  H. Guerin, D. Tsamados, A. M. Ionescu, H. Le Poche, J. Dijon, Horizontally and on-site grown carbon nanotube membrane for sensitive and selective gas sensing, 37rd International Conference on Micro- and Nano-Engineering, MNE 2011, Berlin (Germany).
20.H. Hedler, T. Scheiter, M. Schieber, A. Klumpp and P. Ramm, High Performance 3D Interconnects Based on Electrochemical Etch and Liquid Metal Fill, Proc. IEEE 3D System Integration Conference 2010 - 3DIC Munich (Germany), edited by Peter Ramm and Eric Beyne.
21.  H. Le Poche, H. Guerin, A. Fournier, R. Ramos, M. Fayolle, M. Delaunay, A. M. Ionescuand J. Dijon. "Wafer-scale Integration of In-situ Grown Horizontal Carbon Nanotube Membranes: a Platform to Study Electrical Properties", Nanotech, Washington, DC, June 2014.
22.  H. Le Poche, H. Guerin, R. Pohle, M. Fernández-Bolaños Badía, J. Dijon, A. M. Ionescu, “Resistive gas sensors fabricated by wafer-scale, in-situ integration of horizontal carbon nanotube membranes”, 17th International Conference on Solid-State Sensors, Actuators and Microsystems Transducers, Barcelona, Spain, 2013.
23.  J. Tao, A. Mathewson, K. M. M,Razeeb. Test chip for the characterisation of nanowoire Anisotropic Conductive Film for 3D stacking Applications, IEEE International Conference on Microelectronic test structures , no 7.3 Udine 2014
24.  J. Tao, A. Mathewson , K. M. Razeeb Study of fine pitch microinterconnections formed by low temperature  bonded copper nanowires based anisotripic conductive film. To be  presented ECTC May 2014.
25.  J. Tao, A. Mathewson, K. M. Razeeb Nanowire based Anisotropic Conductive Film (NW-ACF) for Low Temperature 3D Stacking Applications to be presented MINAPAD, Grenoble May 2014.
26.  K. E Aasmundtveit, T-T Luu, A-S Vardøy, T A Tollefsen, K Wang, N Hoivik, "High-Temperature Shear Strength of Solid-Liquid Interdiffusion (SLID) bonding: Cu-Sn, Au-Sn and Au-In, To be presented at ESTC 2014
27.  K. E Aasmundtveit, T-T Luu, A-S Vardøy, T A Tollefsen, K Wang, N Hoivik, "High performance thermal imaging FPA based on Si/SiGe quantum well thermistor in combination with novel 3D wafer level integration concepts", presented at the 22nd Micromechanics Europe Workshop MME2011, June 2011, Tønsberg, Norway.
28.  M. Bring, A. Lapadatu, T. I. Simonsen, G. Kittilsland, "Wafer level vacuum encapsulation for an uncooled microbolometer array", Proc International Wafer-Level Packaging Conference IWLPC 2011, Santa Clara, California, October, 2011.
29.  M. Jamal, M. Hasan, M. Schmidt, N. Petkov, A. Mathewson and K. M. Razeeb, “ Core@shell Ni@NiO nanowire array electrode for catalytic activity towards glucose”, 223rd ECS Meeting, Toronto, Canada Abstract no. 1471, May 12-17 2013.
30.  M. Jamal, B. Aslam, M. Hasan, A. Mathewson and K. M. Razeeb, Non-enzymatic hydrogen peroxide sensor based on nanostructured metallic array electrodes: A comparative study, Abstract no. 1633, 221st ECS Meeting, Seattle, Washington, USA, May 6-11, 2012.
31.  M. Jamal, B. Aslam, M. Hasan, A. Mathewson and K. M. Razeeb, Fabrication of nanoparticle modified nanowire array electrode to detect liver enzyme alanine aminotransferase (ALT), Abstract no. 309, Biosensors 2012, Cancun, Mexico, May 15-18, 2012.
32.  M. M.V. Taklo, A.-S. Vardøy, I. De Wolf, V. Simons, H.J. van de Wiel, A. van der Waal, A. Lapadatu, S. Martinsen, B. Wunderle, “Residual stress in silicon caused by Cu-Sn wafer-level packaging”, InterPACK 2013, Burlingame, CA (USA), July 16-18, 2013.
33.  M. M.V. Taklo, J. S. Graff, D. N. Wright, H. Kristiansen, L. Hoff, K. Waaler, «Failure Analysis Of Thermally And Mechanically Stressed Plastic Core Solder Balls”, ECTC 2013, May, 2013.
34.  M. M.V. Taklo et al., "Robust design for nanostructures for optical field manipulation”, presented at the workshop "Heterogeneous 3D integration considered by the perspective of reliability studied in the European projects e-BRAINS and ESiP", ESREF 2012, Monday October 1, 2012
35.  M. Wiessflecker, G. Hofer, G. Holweg, and W. Pribyl, „An 11 bit SAR ADC Combining a Split Capacitor Array with a Resistive Ladder and a Configurable Noise Time Domain Comparator”,  IEEE 55th MWSCAS Midwest Symp, pp. 101–104, 2012.
36.  M. Wiessflecker, G. Hofer, G. Holweg, and W. Pribyl, „An impedance measurement circuit for wirelessly powered Ics”, 20th Austrian Workshop on Microelectronics, 2012
37.  M. Wiessflecker, G. Hofer, G. Holweg, H. Reinisch, and W. Pribyl, „A sub 1V self clocked switched capacitor bandgap reference with a current consumption of 180nA”, Proc. IEEE Int Circuits and Systems (ISCAS) Symp. pp. 2841–2844, 2012.
38.  M. Wiessflecker, G. Hofer, H. Reinisch, S. Gruber, G. Holweg, W. Pachler, M. Klamminger and W. Pribyl, „A Remotely Powered Multi Frequency RFID Sensing Tag with Integrated Impedance Measurement Interface”, Proc. IEEE Int Circuits and Systems (ISCAS) Symp, 2013, pp. 1910–1913, 2013.
39.  N. Schröter, E. Buitrago, M. Fernandez-Bolaños, W. Raberg, M. Meindl, J. Schotter, C. Zilch, A.M. Ionescu, Immobilization of DNA to Planar and Nanostructured Chip-Surfaces for the Detection of Pathogen-Specific Biomolecules on a Magnetic Bead Based Diagnostic Platform, International Conference on Bio-sensing Technology, Sitges, Spain (2013).
40.  P. Couderc,  R. Dal Molin, How to Bring 3D IC to Maturity Example of a Pacemaker,IMAPS2014 International Conference and Exhibition on Device Packaging, March 11-13 2014, Fountain Hills  Arizona
41.  P. Ramm, “3D Integration – Where do we need to go now?”, Proc. Sematech Workshop on Underfill Challenges for 3D ICs, San Jose, California, November 2012.
42.P. Ramm , A. Klumpp, G. Franz, L. Kwakman, Failure Analysis and Reliability of 3D Integrated Systems, Proc. IMAPS dpc 2011 Scottsdale USA.
43.  R. Pufall, M. Goroll, P. Ramm, M. Taklo, “Lessons learned from the European research project e-BRAINS, An overview of activities and results on methodology of reliability and robustness” Microcar 2013.
44.  S. Hadzialic and M. M.V. Taklo, “Robust design for nanostructures for optical field manipulation”, ESREF 2012, 1st October, Cagliari, Italy, 2012.
45.  S. Hadzialic, I.-R. Johansen, M. M. Visser Taklo, “Nano Structured Optical Coatings, Mirrors and Anti-Reflective Surfaces in Single Crystal Silicon by Patterning of the Silicon Surface”, Northern Optics 2012, 19-21 November, Snekkersten, Denmark, 2012.
46.  S. Hadzialic, M.M.V. Taklo, “Mirrors and anti-reflective surfaces in single crystal silicon by patterning of the silicon surface, Optical MEMS and Nanophotonics 2013, Kanazawa, Japan, Aug. 2013.
47.  T. A. Tollefsen, M. M. V. Taklo, T. Bakke, N. Lietaer, P. Dalsjø Jakob Gakkestad, “Reliability of TSVs and wafer-level bonding for a 3D integrable SOI based MEMS application”,  IWLPC2012, 5-8 November, San Jose, USA, 2012.
48.  T. Bieniek, G. Janczyk, P. Janus, P. Grabiec, M. Nieprzecki, G. Wielgoszewski, M. Moczała, E. Buitrago, A.M. Ionescu, M. Fernandez-Bolaños, Reliability and Robustness Investigation of Novel Nanosensor Structures Using AFM-based Techniques, Innovative Technologies in Medicine (ITMED), Bialystok, Poland (2013).
49.  T. Bieniek, G. Janczyk, P. Janus, P. Grabiec, M. Nieprzecki, G. Wielgoszewski, M. Moczała, E. Buitrago, A.M. Ionescu, M. Fernandez-Bolaños, Silicon Nanowires Reliability and Robustness Investigation Using AFM-based Techniques, Electron Technology Conference, Ryn, Poland (2013), p. 89022L.
50.  T. Bieniek, G. Janczyk, P. Janus, M. Ekwińska, D. Szmigiel, K. Domański, P. Grabiec, P. Dumania, «Efficient Scenarios, Methodology and Tools for MEMS/NEMS Product Development”, 10th International Conference on Multi-Material Micro Manufacture (4m 2013), pp. 284-287, San Sebastian, Spain, 8-11 Oct. 2013.
51.  T. Bieniek, G. Janczyk, P. Janus, P. Grabiec, E. Buitrago, M. Fernandez-Bolaños, A. M. Ionescu, G. Wielgoszewski, M. Moczała, T. Gotszalk, “Reliability and Robustness Investigation of 3D Vertically Stacked Silicon Nanowire Structures Using AFM Based Techniques”, TechConnect World 2013 Nanotech, Microtech, Biotech, Cleantech, Washington, USA, 12-16 May, 2013.
52.  T. Bieniek, G. Janczyk, P. Janus, P. Grabiec, M. Nieprzecki, G. Wielgoszewski, M. Moczała, T. Gotszalk,E. Buitrago, M. Fernandez-Bolaños, A. M. Ionescu, “Silicon Nanowires Reliability and Robustness Investigation Using AFM-Based Techniques”, Proc. SPIE8902, Electron Technology Conference 2013, 25 Jul. 2013. doi:10.1117/12.2031229.
53.  T. Bieniek, G. Janczyk, P. Janus, P. Grabiec, M. Nieprzecki, G. Wielgoszewski, T. Gotszalk, M. Moczała, E. Buitrago, M. Fernandez-Bolaños, A.M Ionescu, “Reliability Investigation by Examination of Dedicated MEMS/ASIC and NWs Test Structures Related to Novel 3D SiP and Nano-Sensors Systems”, Int. Workshop on Testing Three-Dimensional Stacked Integrated Circuits 3D-TEST in Conjunction with ITC, Anaheim, 4-11.Nov., 2012.
54.  T. Bieniek, G. Janczyk, R. Dobrowolski, D. Szmigiel, M. Ekwińska, P. Grabiec, P. Janus, J. Zając, «Dedicated MEMS-based test structure for 3D SiP interconnects reliability investigation”,  Proc. IEEE International 3D Systems Integration Conference, October 2-4 2013, San Francisco,USA.
55.  W. A. Vitale, M. Fernández-Bolaños Badía, R. Wieland, J. Weber and A. Klumpp, P. Ramm et. A. M. Ionescu, Tungsten Through Silicon Vias for 3D high quality factor embedded RF MEMS inductors, Conference 39th International Conference on Micro and Nano Engineering, MNE London, UK, Sept. 2013.
56.  W. A. Vitale, M. Fernández-Bolaños, A. M. Ionescu, “High-Q 3D Embedded Inductors using TSV for RF MEMS Tunable Bandpass Filters (4.65-6.8 GHz)”, Proc. EuMC 2012, Amsterdam, The Netherland, Nov. 2012.
57.  W. Pachler, K. Pressel, J. Grosinger, G. Beer, W. Bösch, G. Holweg, C. Zilch, M. Meindl, "A novel 3D packaging concept for RF powered sensor grains", To be presented at ECTC 2014.
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